What are the package types and packaging processes of RFID tags?

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Electronic labels include paper stickers, cards, and various shaped labels.

RFID electronic tags are packaged in many forms and are not subject to size and standard shape, and their composition is also different. Therefore, the packaging process processes such as antenna fabrication, bump formation, and chip bonding interconnection are also diverse.

Package form of RFID electronic tag

Card class

Laminated: There are two types of melt and seal. The melt pressure is produced by heating and pressing the inlay sheet of the center layer and the upper and lower pieces of PVC material. The PVC material is fused with the inlay and then die-cut into the specified size.

Gluing type: The paper and other materials are used to make the Transponder upper and lower materials glue together by cold glue, and then die-cut into cards of various sizes.

Label class

Paste type: The finished product can be made into the label form of manual or labeling machine, which is the most mainstream product in practical application.

Tag type: It is a tag type product corresponding to clothing and articles. It is characterized by compact size and can be recycled.

Alien

Metal surface setting type: Since the electronic label is affected by metal to a certain extent and cannot work normally, the type label can be read and written on the metal after special treatment.

Wrist strap type: Can be used once or repeatedly.

What are the package types and packaging processes of RFID tags?

RFID electronic label packaging process

Antenna Manufacturing Wound Antenna Substrate---- Corresponding to Wire Bonding Package

Printed Antenna Substrate---- Corresponding to Flip Chip Conductive Adhesive Package

Etched antenna substrate----corresponding to wire bond package or template riveted package

The formation of bumps: At present, the characteristics of RFID tag products are various, but not the number of each type can be scaled. Therefore, the use of flexible bump making technology has low cost, high packaging efficiency, convenient use, flexibility, and process control. Simple, high degree of automation.

RFID chip interconnection method: One of the main goals of RFID tag manufacturing is to reduce costs. To this end, the process should be reduced as much as possible, low-cost materials should be selected, and process time should be reduced.

Last update: Dec 25, 2018

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